Valmet Completes Severn Group Acquisition, Expanding Global Flow Control Capabilities
Valmet has successfully completed its acquisition of Severn Group, a leading industrial valve company specializing...
HEIDELBERG Expands Printing and Packaging Leadership with manroland sheetfed Integration and POLAR Acquisition
Heidelberger Druckmaschinen AG (HEIDELBERG) has strengthened its position in the global printing...
Lactips and SmartSolve Unveil Water-Soluble Packaging for Beauty and Personal Care Markets
Lactips and SmartSolve have introduced a new generation of water-soluble packaging solutions aimed...
Applied Materials Unveils Advanced 3D Chip Manufacturing Tools for AI and HBM Packaging
Applied Materials has introduced a new portfolio of 3D chip manufacturing technologies...
Propak West Africa 2026 Set to Accelerate Growth in the Region’s Packaging Industry
West Africa’s packaging, printing, and labeling industries are poised for significant growth...
Intel Names Seok-Hee Lee to Lead Advanced Packaging and Foundry Growth
Intel has appointed semiconductor industry veteran Seok-Hee Lee as Executive Vice President of its...
TSMC and Amkor Forge 10-Year Arizona Partnership to Strengthen U.S. Semiconductor Packaging Ecosystem
Taiwan Semiconductor Manufacturing Company (TSMC) and Amkor Technology have entered into a...
