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Wednesday, October 21, 2026
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News

Windmöller & Hölscher introduces ONEFLEX: the newest CI flexo press for flexible packaging printing

With a new modular machine, an optimized print deck and production speeds of up to 600 m/min, ONEFLEX...

Archroma Packaging Technologies Launches Erthana™

New platform released at PACK EXPO to help the packaging industry meet its sustainability goals without compromising performance at...

Events

COMPACK 2027 — The Flagship Returns to Chennai for South India’s Definitive Packaging Exhibition

Fifteen editions built COMPACK into South India's definitive B2B packaging platform. After taking the show on the road to Vijayawada and Kochi,...

CorrVision Expo 2027

Interview

Onyx Testing Machines

Onyx Testing Machines is an Indian manufacturer and supplier of laboratory testing equipment for paper, paperboard, corrugated board and packaging materials. The...

Boxo Machines

Khusi Industries

Eagle Manufacturing Company

Technology

Popular

Special Feature

UPM, Ingredion and Paramelt explore the potential of starch-based barriers in recyclable paper packaging

UPM, Ingredion, a global ingredient solutions company, and Paramelt, a...

COMPACK 2027 — The Flagship Returns to Chennai for South India’s Definitive Packaging Exhibition

Fifteen editions built COMPACK into South India's definitive B2B...

CorrVision Expo 2027

CorrVision Expo 2027 returns to Pune from 11–13 March,...

PackPlus South 2026 | 3-4-5 Dec ‘2026

PackPlus South 2026 brings packaging and printing professionals together...

Sun Chemical launches next-generation GIO-compliant SolarFlex FSP UV flexo inks

Sun Chemical launches its next-generation SolarFlex FSP UV flexographic...

Product New

Latest Articles

Windmöller & Hölscher introduces ONEFLEX: the newest CI flexo press for flexible packaging printing

With a new modular machine, an optimized print deck and production speeds of up to 600 m/min, ONEFLEX brings a new level of performance,...

Archroma Packaging Technologies Launches Erthana™

New platform released at PACK EXPO to help the packaging industry meet its sustainability goals without compromising performance at PACK EXPO International 2026 in Chicago, Archroma...

UPM, Ingredion and Paramelt explore the potential of starch-based barriers in recyclable paper packaging

UPM, Ingredion, a global ingredient solutions company, and Paramelt, a global producer of functional coatings have joined forces to investigate how plant-based starch barrier technologies...

Events

COMPACK 2027 — The Flagship Returns to Chennai for South India’s Definitive Packaging Exhibition

Fifteen editions built COMPACK into South India's definitive B2B...

CorrVision Expo 2027

CorrVision Expo 2027 returns to Pune from 11–13 March,...
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