Intel Names Seok-Hee Lee to Lead Advanced Packaging and Foundry Growth
Intel has appointed semiconductor industry veteran Seok-Hee Lee as Executive Vice President of its Intel Foundry division, reinforcing the company’s commitment to expanding its advanced packaging capabilities and contract manufacturing business.
The appointment comes as Intel continues its efforts to strengthen its manufacturing operations under CEO Lip-Bu Tan and capitalize on growing demand for advanced semiconductor technologies.
Lee will report directly to Tan and oversee Intel’s advanced packaging, system integration, back-end technology development, and manufacturing operations. Advanced packaging has become a critical area for the semiconductor industry, enabling chipmakers to enhance performance by integrating multiple chips into a single package.
A highly respected industry leader, Lee previously served as CEO of both SK Hynix and SK On, bringing extensive experience in memory and semiconductor manufacturing.
With Lee taking charge of back-end operations, Naga Chandrasekaran, Executive Vice President of Intel Foundry, will concentrate on front-end technology development and manufacturing. His focus will include accelerating the production ramp-up of Intel’s 18A, 14A, and future process technologies.
The leadership change follows several strategic moves by Intel to expand its foundry business. Earlier this year, the company hired former Samsung foundry executive Shawn Han to strengthen its contract manufacturing efforts. Intel also secured Tesla as the first major customer for its next-generation 14A manufacturing process, which is expected to enter mass production in 2029.
Additionally, the appointment comes amid renewed momentum for Intel’s U.S. manufacturing ambitions following President Donald Trump’s announcement that Apple would collaborate with Intel on chip design and manufacturing projects in the United States.
The move highlights Intel’s growing emphasis on advanced packaging and foundry services as it seeks to position itself as a leading manufacturing partner in the global semiconductor industry.
