Intel Names Seok-Hee Lee to Lead Advanced Packaging and Foundry Growth
Intel has appointed semiconductor industry veteran Seok-Hee Lee as Executive Vice President of its...
TSMC and Amkor Forge 10-Year Arizona Partnership to Strengthen U.S. Semiconductor Packaging Ecosystem
Taiwan Semiconductor Manufacturing Company (TSMC) and Amkor Technology have entered into a...
London Packaging Week 2026 Highlights Packaging’s Strategic Role in Business Growth
London Packaging Week has unveiled the first wave of speakers for its 2026 conference...
Gould Industries Expands into the U.S. with Major Mississippi Manufacturing Investment
Gould Industries is a Canadian private-label packaging manufacturer founded in 1954. The company produces...
Tetra Pak and Jealsa Introduce Industry-First Carton Pack for Shelf-Stable Tuna
Tetra Pak, in partnership with Spanish seafood producer Jealsa, has introduced the industry's first...
Holostik Group Secures Three Honours at FIPSA 2026 Responsible Packaging Awards
Holostik Group has strengthened its position as an innovation leader in the packaging industry...
