ITP Technology Powers WorldStar 2026 Award-Winning Sustainable Packaging Solution
ITP – Industria Termoplastica Pavese (ITP) has announced its technological contribution to PaperSeal® Shape, an innovative...
Applied Materials Unveils Advanced 3D Chip Manufacturing Tools for AI and HBM Packaging
Applied Materials has introduced a new portfolio of 3D chip manufacturing technologies...
UAE Economy Minister Visits Hotpack’s NIP Facility as Company Accelerates Global Expansion
Hotpack, one of the GCC’s leading food packaging manufacturers, welcomed His Excellency Abdulla...
Incheon Strengthens Position as Korea’s Advanced Semiconductor Packaging Hub
Incheon is intensifying efforts to develop its advanced semiconductor packaging industry, with the Incheon Semiconductor Forum...
Fully Automated Corrugated Production Sets New Industry Benchmark
The corrugated packaging industry is entering a new era of intelligent manufacturing, where automation, robotics, and real-time...
Bharat Packaging Expo 2027 to Bring Global Packaging Ecosystem to India
The road to Bharat Packaging Expo 2027 officially began with a curtain raiser event...
GEODIS Completes Global Pilot of Paper-Based Thermal Covers for Pharma Cold Chain Logistics
Global logistics provider GEODIS has completed a pilot program testing paper-based thermal...
