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Monday, September 21, 2026
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E-MAGAZINE

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News

Schobertechnologies Unveils XXL Delivery System for RSM410 IML/MX

Schobertechnologies Unveils XXL Product Delivery System for the RSM410 IML/MX New Delivery Technology Significantly Increases Productivity in Die-Cutting and...

KleanNara Expands Clay-Coated Board Exports to South Africa

KleanNara Expands Clay-Coated Board Exports to South Africa South Korean paper products manufacturer KleanNara is expanding exports of its...

Events

Pack Print Asia 2027 to Bring Packaging and Printing Technologies to Gandhinagar

Pack Print Asia 2027 to Focus on Next-Generation Packaging and Printing Technologies Pack Print Asia 2027 will be held from 4 to 6...

Interview

Dongguang Canghai Packing Machine Co.,LTD

Read our exclusive interview with Mr. Shi, Chairman of Dongguang Canghai Packing Machine Co., Ltd., on packaging machine innovation, automation, and advanced...

Formonix Starch

CARTON MFG. CO.

Technology

Popular

Special Feature

Paranova and AMFresh Launch Grapes in Fibre-Based Packaging

Paranova and AMFresh Launch New Grape Variety in Fibre-Based...

Supremex Announces $4 Million Investment Across Three U.S. Plants

Supremex Announces $4 Million Investment Across Three U.S. Plants Supremex...

Durst Group will Acquire MPS, Expanding Its Label Printing Platform

Durst Group will Acquire MPS, Expanding Its Label Printing...

Nestlé and PepsiCo Join PaperFlex Consortium to Advance Paper Packaging

Nestlé and PepsiCo Join PaperFlex Consortium to Advance Paper...

Product New

Latest Articles

West Africa Packaging Sector Set for Expansion Ahead of Propak 2026

Propak West Africa 2026 Set to Accelerate Growth in the Region’s Packaging Industry West Africa’s packaging, printing, and labeling industries are poised for significant growth...

Sri Lanka’s Largest Print & Packaging Expo Opens with Focus on Innovation

Sri Lanka Print Expo 2026 and National Print Excellence Awards to Drive Industry Innovation and Sustainability Sri Lanka’s printing and packaging industry is set to...

Intel Appoints Seok-Hee Lee to Lead Advanced Packaging Strategy Amid Foundry Expansion

Intel Names Seok-Hee Lee to Lead Advanced Packaging and Foundry Growth Intel has appointed semiconductor industry veteran Seok-Hee Lee as Executive Vice President of its...

Events

Pack Print Asia 2027 to Bring Packaging and Printing Technologies to Gandhinagar

Pack Print Asia 2027 to Focus on Next-Generation Packaging...

PackVision Expo 15th October – 17th October 2026

The PackVision Expo, scheduled from 15-17 October 2026, Chennai...
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