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Thursday, November 5, 2026
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E-MAGAZINE

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News

Logson Group completes acquisition of Playford Packaging

Logson Group, the UK’s largest independent manufacturer of corrugated packaging, is pleased to announce the acquisition of Playford...

GARANT Introduces the dedicated Matador e.Bag No Waste

W&H's GARANT introduces a high-performance paper mailer bag machine designed to reduce material consumption and minimise production waste. In...

Events

Bharat Packaging Expo 2027

Bharat Packaging Expo 2027 is Unleashing Packaging Brilliance! Bharat Packaging Expo 2027 is more than an exhibition. It is India’s leading platform where...

PackVision Expo

CorrVision Expo 2027

Interview

Onyx Testing Machines

Onyx Testing Machines is an Indian manufacturer and supplier of laboratory testing equipment for paper, paperboard, corrugated board and packaging materials. The...

Boxo Machines

Khusi Industries

Eagle Manufacturing Company

Technology

Popular

Special Feature

Kao and SCGP Strengthen Strategic Partnership to Advance Sustainable Packaging Innovation

Kao Industrial (Thailand) Co., Ltd., a leading Japanese manufacturer...

J.S. McCarthy Builds a Faster, More Reliable Folding Carton Operation with Leary

Sempre-i cold glue application, CleanStart technology, advanced inspection and...

Ennis Acquires Telemark Diversified Graphics, Expands Thermal Paper Business

Ennis, Inc.   announced that it has acquired Telemark Diversified...

Sonoco to Modernize and Expand URB Production at Richmond, VA Mill

Sonoco Products Company  the largest producer of uncoated recycled...

Product New

Latest Articles

Sri Lanka’s Largest Print & Packaging Expo Opens with Focus on Innovation

Sri Lanka Print Expo 2026 and National Print Excellence Awards to Drive Industry Innovation and Sustainability Sri Lanka’s printing and packaging industry is set to...

Intel Appoints Seok-Hee Lee to Lead Advanced Packaging Strategy Amid Foundry Expansion

Intel Names Seok-Hee Lee to Lead Advanced Packaging and Foundry Growth Intel has appointed semiconductor industry veteran Seok-Hee Lee as Executive Vice President of its...

TSMC and Amkor Forge 10-Year Arizona Partnership to Strengthen U.S. Semiconductor Packaging Ecosystem

TSMC and Amkor Forge 10-Year Arizona Partnership to Strengthen U.S. Semiconductor Packaging Ecosystem Taiwan Semiconductor Manufacturing Company (TSMC) and Amkor Technology have entered into a...

Events

Bharat Packaging Expo 2027

Bharat Packaging Expo 2027 is Unleashing Packaging Brilliance! Bharat Packaging...

PackVision Expo

Visit PackVision Expo – Packaging Exhibition in Pune Register to...
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