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Friday, October 23, 2026
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Zepto and ITC Introduce Limited-Edition Dazzle Vibe Matchbox Collection for Diwali

The Dazzle Vibe Matches: LIT Parivar Edition combines nostalgic matchbox designs with festive themes, celebrating family relationships and...

Valmet’s key technology delivery supports efficient and flexible pulp production at the new Century Sunshine Rizhao mill in China

Valmet is delivering key technology for Century Sunshine’s new Rizhao pulp mill that is being built in Shandong...

Events

COMPACK 2027 — The Flagship Returns to Chennai for South India’s Definitive Packaging Exhibition

Fifteen editions built COMPACK into South India's definitive B2B packaging platform. After taking the show on the road to Vijayawada and Kochi,...

CorrVision Expo 2027

Interview

Onyx Testing Machines

Onyx Testing Machines is an Indian manufacturer and supplier of laboratory testing equipment for paper, paperboard, corrugated board and packaging materials. The...

Boxo Machines

Khusi Industries

Eagle Manufacturing Company

Technology

Popular

Special Feature

Definol® borax-free adhesives exempt from new labelling rules

Crespel & Deiters offers high-performance adhesives that are not...

Fiber-based sugar sticks and sachets reduce packaging fees

Whether in a café, a hotel, or a cafeteria,...

Archroma Packaging Technologies Launches Erthana™

New platform released at PACK EXPO to help the...

UPM, Ingredion and Paramelt explore the potential of starch-based barriers in recyclable paper packaging

UPM, Ingredion, a global ingredient solutions company, and Paramelt, a...

Product New

Latest Articles

Fiber-based sugar sticks and sachets reduce packaging fees

Whether in a café, a hotel, or a cafeteria, sugar is often served in small sticks and sachets. These single serving packages usually contain...

Windmöller & Hölscher introduces ONEFLEX: the newest CI flexo press for flexible packaging printing

With a new modular machine, an optimized print deck and production speeds of up to 600 m/min, ONEFLEX brings a new level of performance,...

Archroma Packaging Technologies Launches Erthana™

New platform released at PACK EXPO to help the packaging industry meet its sustainability goals without compromising performance at PACK EXPO International 2026 in Chicago, Archroma...

Events

COMPACK 2027 — The Flagship Returns to Chennai for South India’s Definitive Packaging Exhibition

Fifteen editions built COMPACK into South India's definitive B2B...

CorrVision Expo 2027

CorrVision Expo 2027 returns to Pune from 11–13 March,...
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